Traduzir bga para inglês - Tradutor de chinês para inglês

ZH FCBGA 倒装芯片 BGA (FlipChip BGA） - Amkor Technology

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EN FCBGA Flip Chip BGA FlipChip BGA - Amkor Technology

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ZH 0.4 毫米、0.5 毫米、0.65 毫米、0.8 毫米和 1.0 毫米节距 BGA

毫米和毫米节距 BGA

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EN 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm pitch BGA footprints

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ZH 层压式封装采用 BGA 设计，它在引线框架基板上方覆上一层塑料或软性层压基板，并将电力连接置于封装底部，而不是分布于四周。

层压式封装采用 BGA

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EN Laminate packages employ a BGA design, which utilizes a plastic or tape laminate substrate over a leadframe substrate, and places the electrical connections on the bottom of the package rather than around the perimeter.

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ZH 均匀分布于基板底部的凸块为系统板提供电力连接。相对于引脚框架封装，此 BGA 格式能降低电阻和电感，并增加互连的数量。

BGA

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EN Evenly distributed bumps across the bottom surface of the substrate provide the electrical connection to the system board. This BGA format offers lower thermal resistance, lower inductance and a higher number of interconnects than leadframe packages.

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ZH 底部可堆叠极小节距 BGA (PSvfBGA) 于 2004 年推出，采用焊线或混合（倒装芯片和焊线）堆叠支持单晶粒和堆叠晶粒，通过测试和 SMT 处理，它被运用于改善倒装芯片翘曲控制和封装完整性。

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EN Package Stackable Very Thin Fine Pitch BGA (PSvfBGA), launched in 2004, supports single and stacked die using wire bond or hybrid (flip chip plus wirebond) stacks to improve flip chip warpage control, package integrity through test and SMT handling.

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ZH Diodes Incorporated 的 PI7C9X3G816GP 採用 324 球 BGA 格式高效能覆晶封裝方式，尺寸為 19mm x 19mm。

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EN Diodes Incorporated’s PI7C9X3G816GP is supplied in a high-performance flip-chip (HFC) package, with 324-ball BGA format and 19mm x 19mm dimensions. This packet switch has a unit price of $31.00 in 1,000 piece quantities.